Picture this: You have a bag of heavily used clothes that can no longer be donated taking up space in your closet, so you drop it off at your local recycling center. But what happens to that bag of clothes? You might assume that the clothes would get
Today, the U.S. Department of Commerce announced that CHIPS for America awarded the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) $285 million to establish and operate a CHIPS Manufacturing USA institute headquartered
To bolster the nation’s preparedness for a pandemic, the National Institute of Standards and Technology (NIST) has developed a synthetic, nonhazardous genetic material to support the development and validation of diagnostic tests for the H5N1 virus
The National Construction Safety Team has reached an important milestone in its investigation into the 2021 partial collapse of Champlain Towers South.
San Francisco, California – Today the U.S. Department of Commerce and U.S. Department of State are co-hosting the inaugural convening of the International Network of AI Safety Institutes, a new global effort to advance the science of AI safety and
The lab focuses on advancing communications technology through research and development in core network technologies, next-generation wireless systems, public safety communications, smart infrastructure and spectrum sharing.
Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced Sunnyvale, California as the expected location for the CHIPS for America Design and Collaboration Facility (DCF), an NSTC
Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility. The CHIPS for
Today, the Biden-Harris Administration announced a Notice of Funding Opportunity (NOFO) for activities that will use cutting-edge artificial intelligence (AI) and autonomous experimentation (AE) technologies to support the long-term viability of next
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Hemlock Semiconductor (HSC) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $325 million in proposed direct funding under the
Today, the Biden-Harris Administration issued a Notice of Funding Opportunity (NOFO) funded by the CHIPS and Science Act to enable the United States semiconductor industry to adopt innovative new advanced packaging flows for semiconductor
Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $93 million in proposed direct funding under the CHIPS and Science Act.
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Wolfspeed, Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $750 million in proposed direct funding under the CHIPS and